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June 30, 2004IEEE Electron Device Letters

12 W/mm AlGaN–GaN HFETs on Silicon Substrates

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Authors

JJJ. W. JohnsonUniversity of GeorgiaEPE. L. PinerTexas State UniversityAVAndrei VescanErnst Ruska Centre

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Implication

Experimental study demonstrates a 12 W/mm power density in AlGaN-GaN transistors on silicon substrates, indicating performance competitive with devices on conventional substrates.

Key Points

  • Fabricate and characterize high-performance AlGaN-GaN heterojunction field-effect transistors grown directly on high-resistivity silicon substrates.
  • Grew Al0.26Ga0.74N-GaN heterostructures on 100-mm high-resistivity Si (111) wafers via metal-organic chemical vapor deposition.
  • Fabricated 0.7-μm gate-length devices and evaluated direct current, breakdown, high-frequency, and RF power performance.
  • Achieved a two-dimensional electron gas sheet resistance of 300 ± 10 Ω/square, maximum drain current density of ~1 A/mm, and breakdown voltage of ~200 V.
  • Measured a cutoff frequency of 18 GHz and maximum oscillation frequency of 31 GHz for 0.7-μm gate devices.
  • Delivered a 2.14-GHz continuous-wave power density of 12 W/mm at 50 V bias, with 15.3 dB large-signal gain and 52.7% power-added efficiency.

Cite This Study

Johnson et al. (2004) studied this question.

synapsesocial.com/papers/6a700ffce36a167817e1c981https://doi.org/10.1109/led.2004.831190
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