The physical design of large electronic switching systems (esss) requires a comprehensive set of technologies and design tools. The technology used for the 1A Processor and several esss consists of silicon integrated circuits, thin-film hybrid circuits, discrete component packaging, and apparatus to interconnect, power, and communicate with these devices. The application tools consist of comprehensive design guidelines and computer aids for circuit, logic, thermal, and physical design. In addition, computer aids are provided for documentation and preparation of information for manufacturing and testing. This paper uses text and illustrations to describe the design details and achieved performance of each of the major elements of the technology.
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Becker et al. (1977) studied this question.
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