A new process for the fabrication of high current and very low profile micromachined inductors has been developed. This process involves the combination of mechanical lamination and electrodeposition of copper windings by means of LIGA-like lithography through thick epoxy photoresists. The dimension of the fabricated inductor is 16 mm/spl times/19 mm/spl times/1 mm. The fabricated inductor has an inductance value of 1.2 /spl mu/H with DC saturation current of 3 A and an electrical resistance of less than 30 m/spl Omega/ at 10 kHz.
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Park et al. (2002) studied this question.
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