Answers are grounded in this paper and cite their sources.
Plastic molded packages for large-scale integrated (LSI) devices are widely utilized for low-cost computer equipment. The environmental reliability of conventional plastic molded packages, however, is inferior to the reliability of hermetically sealed ceramic packages. A sealing mechanism for the chip, using a silicone jelly as an encapsulation, is discussed.
No takes yet. Share an insight, caveat, or question.
Otsuka et al. (1984) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: