Experimental analysis demonstrates improved fatigue life prediction with an energy-based criterion across varied solder specimens, suggesting more reliable electronic packaging assessments.
An energy-based damage criterion, which has not been used previously in solder fatigue life assessment, was found to be superior to a plastic strain criterion in predicting the fatigue life of different solders. Solder specimens of different size and geometry were tested under different types of control and with different loading modes and aging conditions.>
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Vaynman et al. (1993) studied this question.
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