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There is an urgent need for polymer composites with high thermal conductivity and electrical insulation in microelectronic packaging.Due to their fascinating chemical and physical properties, multi-walled carbon nanotubes (MWCNTs) have enabled major achievements in polymer composites fields as a reinforcement filler.Nevertheless, high conductivity of raw MWCNTs (R-MWCNTs) was an obstacle to wider application of the CNTs in some special fields, which require outstanding thermal conductivity and insulation properties simultaneously.In this work, silica@MWCNTs were prepared to reduce the electrical conductivity.The composites
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Wu et al. (2023) studied this question.
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