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To evaluate their compatibility for use in a liquid-nitrogen computer, metallized ceramic packages with test chips using controlled-collapse solder (Pb-Sn) technology were cycled between 30 degrees C and liquid-nitrogen temperature. Room-temperature electrical resistance measurements were made at regular intervals of cycles to determine whether solder failure accompanied by a significant resistance increase had occurred. For the failed solder joints characterized by the highest thermal shear strain amplitude of 3.3%, it was possible to estimate the number of liquid-nitrogen cycles needed to produce the corresponding failure rate using a room-temperature solder lifetime model. Cross-sectional examination of the failed solder joints using scanning electron microscopy (SEM) and energy-dispersive X-ray analysis indicated solder cracking occurring at the solder-ceramic interface. Chip-pull tests on cycled packages yielded strengths far exceeding the minimal requirement. Mechanisms involving the formation of intermetallics are proposed to account for the observed solder fracture modes after liquid-nitrogen cycling and after chip pull. SEM examination of pulled chips in cycled packages found no apparent sign of cracking in quartz and polyimide for chip insulation.>
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Tong et al. (1989) studied this question.
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