The characteristics of thermal polyoxide grown on large-grain polysilicon-on-insulator (LPSOI) formed by high temperature enhanced metal-induced-lateral-crystallization (MILC) have been investigated. Compared with conventional polysilicon films, LPSOI films have reduced surface roughness and a smaller number of grain boundaries. The improved polysilicon quality leads to better thermal oxide quality, especially at device dimensions that are smaller than the grain size. Intrinsic oxide characteristics such as breakdown voltage, leakage current and charge-to-breakdown value have been experimentally measured. Significant improvement in both oxide quality and device-to-device variation is reported.
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Chan et al. (2001) studied this question.
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