Rapid Prototyping of Masks for Through-Mask Electrodeposition of Thick Metallic Components

A flexible and inexpensive approach for rapid prototyping of thick masks (∼130 μm in height) for through-mask electrodeposition of metallic microstructures is demonstrated. The electrodeposition masks are fabricated directly from a computer-aided design layout by patterning adhesive-backed polyvinyl chloride tape using a laser. The pliant tape masks can then be transferred directly to planar or nonplanar substrates. We demonstrate the use of the tape mask on a nonplanar substrate by plating a NiFe microcoil on a cylindrical rod. The pattern transfer characteristics of the tape mask are illustrated by plating copper columns on a platinum rotating disk electrode. We also fabricate a two-level NiFe criss-cross structure to show how these tape masks can be used to build structures in three dimensions. Limitations of the existing laser system permit minimum lateral feature dimensions of 130 μm, though the method developed here should readily scale down in feature dimensions using a higher energy pulsed laser.