Highly robust ultrathin silicon nitride films grown at low-temperature by microwave-excitation high-density plasma for giga scale integration

This paper focuses attention on electrical properties of ultra-thin silicon nitride films grown by radial line slot antenna high-density plasma system at a temperature of 400/spl deg/C as an advanced gate dielectric film. The results show low density of interface trap and bulk charge, lower leakage current than jet vapor deposition silicon nitride and thermally grown silicon oxide with same equivalent oxide thickness. Furthermore, they represent high breakdown field intensity, almost no stress-induced leakage current, very little trap generation even in high-field stress, and excellent resistance to boron penetration and oxidation.