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July 1, 1992Chemistry of Materials

Hot-wall chemical vapor deposition of copper from copper(I) compounds. 2. Selective, low-temperature deposition of copper from copper(I) .beta.-diketonate compounds, (.beta.-diketonate)CuLn, via thermally induced disproportionation reactions

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Authors

HSHyung Kyu ShinUniversity of Nevada, RenoKMK. M.SRM UniversityMHMark J. Hampden‐SmithSaint-Gobain (United States)

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Shin et al. (1992) studied this question.

synapsesocial.com/papers/6a72ae0efebe604dd70ab869https://doi.org/10.1021/cm00022a009
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