Independent interlayer microfluidic cooling for heterogeneous 3D IC applications

Presented for the first time is the implementation of independent microfluidic cooling of different tiers in a 3D stack based on their power dissipation. The impact of this approach on heterogeneous 3D IC stacks, such as memory‐on‐processor and processor‐on‐processor with different power dissipations, has been experimentally explored. The junction temperature difference between tiers with different power dissipation is decreased from 12 to 7°C. Significant junction temperature reduction and thermal decoupling are achieved by this approach compared to air‐cooling.