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June 1, 2005IEEE Design & Test of Computers

Demystifying 3D ICs: The Pros and Cons of Going Vertical

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Authors

WDW. Rhett DavisNorth Carolina State UniversityJWJohn WilsonNorthumbria UniversitySMStephen MickNorth Carolina State University

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Davis et al. (2005) studied this question.

synapsesocial.com/papers/6a7d4ef1b0b0e582d537dc3dhttps://doi.org/10.1109/mdt.2005.136
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Also Consider

Synapse has enriched 3 closely related papers on similar clinical questions. Consider them for comparative context:

  1. 1Thermal analysis of three-dimensional (3-D) integrated circuits (ICs)2001 · 87 citations
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  3. 3Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach2003 · 219 citations