In this paper we present, the calculation of temperature transients in devices where the electromagnetic and heat, transfer processes are coupled. We have extended the finite element electromagnetic code (WEMAP) in such a manner that the calculated power loss densities in a multiconductor system are used as the heat, sources for a transient thermal solution in subregions of the original problem geometry. These subregions are enclosed by surfaces on which either temperature, or a convection boundary condition is known. The implementation of this capability will be shown by way of an example.
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Garg et al. (1987) studied this question.
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