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We present a high-spatial-resolution subsurface microscopy technique that significantly increases the numerical aperture of a microscope without introducing an additional spherical aberration. Consequently, the diffraction-limited spatial resolution is improved beyond the limit of standard subsurface microscopy. By realizing a numerical aperture of 3.4, we experimentally demonstrate a lateral spatial resolution of better than 0.23 μm in subsurface inspection of Si integrated circuits at near infrared wavelengths.
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Ippolito et al. (2001) studied this question.
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