The temperature rise induced by shock compression of polymethyl methacrylate(PMMA) was determined from measurements of the electrical resistivity of embedded copper foils. The temperature of the copper was determined from the observed foil resistance and known values of the change in copper resistivity with temperature and shock compression. It was inferred, from equilibration evident on the records, that the copper and PMMA were at the same temperature. Observed values for the temperature rise in PMMA were 44 and 409 K for compressions of 14.0% and 22.4%, respectively; these values are in good agreement with those reported previously on the basis of thermocouple measurements.
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Bloomquist et al. (1981) studied this question.
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