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This paper reviews the high-density parallel-optical modules for use in board-to-board application in optical interconnects and describes their application, mechanical sizes, electrical-pluggable interfaces, optical-pluggable interfaces, transmission performance, and power consumption. Since board-to-board optical interconnects require a high data rate per channel of at least 10 Gb/s/ch, a power consumption of not more than 10 mW/Gb/s/link, and high reliability based on massive volume requirement, the usage of 1-μm wavelength range using InGaAs high-efficient semiconductor devices is promising to meet these requirements.
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Hideyuki Nasu (2010) studied this question.
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