Experimental study demonstrates minimal polymer deformation during microfluidic chip fabrication, highlighting a low-temperature bonding method using dual glass transition temperatures.
Polymer bonding is widely employed in thermal welding, ultrasonic welding, laser welding, and surface-activated bonding. To adapt bonding properties to the smaller microstructure and complexity of a microfluidic chip, the bonding process should produce low polymer structure deformation and strong bonding strength. To fabricate a microfluidic chip without an adhesive layer, a new precision polymer bonding process that employs a nanostructure and two different layers of the same polymer material with different glass transition temperatures ( T g ) is devised. Low-temperature bonding (less than 20 °C) was achieved. A deformation ratio of 1.1% was obtained, which is 10 times smaller than that for the typical thermal-bonding process. Thus, a precision bonding technique for a low-deformation microstructured chip was successfully developed.
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Kurihara et al. (2020) studied this question.
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