A Practical Implementation of Silicon Microchannel Coolers for High Power Chips

This paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance 10.5 C-mm2/W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of2. Coolers of this design should be able to cool chips with average power densities of 400W/cm2or more