Thermofluid Design of Single-Phase Submerged-Jet Impingement Cooling for Electronic Components

Technical Briefs Thermofluid Design of Single-Phase Submerged-Jet Impingement Cooling for Electronic Components D. E. Maddox, D. E. Maddox 3M ICPD, St. Paul, MN 55144-1000 Search for other works by this author on: This Site PubMed Google Scholar A. Bar-Cohen A. Bar-Cohen University of Minnesota, Minneapolis, MN Search for other works by this author on: This Site PubMed Google Scholar Author and Article Information D. E. Maddox 3M ICPD, St. Paul, MN 55144-1000 A. Bar-Cohen University of Minnesota, Minneapolis, MN J. Electron. Packag. Sep 1994, 116(3): 237-240 (4 pages) https://doi.org/10.1115/1.2905692 Published Online: September 1, 1994 Article history Received: September 5, 1991 Revised: October 29, 1993 Online: April 28, 2008