Synapse
⌘+K
Synapse
PulseExploreClubsResearchersJournals
Instagram
HomeClubsExplore
June 20, 2026Journal of Electronic Packaging

Analysis of Multi-Finger GaN HEMTs Using Gate Resistance Thermometry, Raman Thermometry, and Infrared Thermal Microscopy

View Full Paper
Ask AI
Bookmark
Share

Authors

SKS H KimPennsylvania State UniversityDSDaniel ShoemakerPennsylvania State UniversityHWHusam WalwilPennsylvania State University

Discussion

Loading...

Member takes

Overview

Randomized trial quantifies channel temperature distribution in multi-finger GaN HEMTs, highlighting critical thermal effects.

Key Points

  • The study aims to quantify the channel temperature distribution in multi-finger GaN HEMTs and analyze self-heating effects.
  • Fabricated 16-finger GaN HEMTs with gate resistance thermometry structures.
  • Validated GRT measurements against localized Raman thermometry.
  • Built a 3D finite element analysis thermal model using measured material thermal properties.
  • The center channel showed a ~22% greater temperature rise compared to the outer channel.
  • Infrared thermography underestimated channel temperatures due to spatial resolution limitations.
  • The study confirms the presence of thermal crosstalk in multi-finger GaN HEMTs.

Cite This Study

Kim et al. (2026) studied this question.

synapsesocial.com/papers/6a362ee4db0793dc1a5368c4https://doi.org/10.1115/1.4072184
View Full Paper
Ask AI
Bookmark
Share

Also Consider

Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context:

  1. 1Thermophysical property measurement of GaN/SiC, GaN/AlN, and AlN/SiC epitaxial wafers using multi-frequency/spot-size time-domain thermoreflectance2025 · 30 citations
  2. 2Specific heat of aluminum from zero to its melting temperature and beyond. Equation for representation of the specific heat of solids1970 · 108 citations
  3. 3Demonstration of Constant 8 W/mm Power Density at 10, 30, and 94 GHz in State-of-the-Art Millimeter-Wave N-Polar GaN MISHEMTs2017 · 238 citations
  4. 4Embedded Cooling for Wide Bandgap Power Amplifiers: A Review2019 · 122 citations
  5. 5Thermal transport through GaN–SiC interfaces from 300 to 600 K2015 · 101 citations