A novel process for the manufacturing of advanced interconnects

A wide variety of novel processing techniques can be used in conjunction with new polymer technologies to enable the clean, efficient and accurate manufacturing of interconnects that provide new solutions to meet the challenges of future environmental, customer and market demands. This paper discusses work undertaken on the development of a suite of alternative approaches to the conventional interconnect manufacturing routes. These new approaches not only offer distinct advantages for the short batch or prototype market, but more interestingly also offer possibilities for use in the high volume, high density interconnect market that increasingly needs innovative manufacturing approaches for many types of electronics products. A new process using mechanical routing or laser ablation in combination with conductive pastes is described.