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September 1, 1998IBM Journal of Research and Development

Damascene copper electroplating for chip interconnections

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Authors

PAP. C. AndricacosIBM Research - Thomas J. Watson Research CenterCUCyprian UzohXperi (United States)JDJohn DukovicApplied Materials (United States)

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Cite This Study

Andricacos et al. (1998) studied this question.

synapsesocial.com/papers/6a7d0458ec6dad7f5aaa05b4https://doi.org/10.1147/rd.425.0567
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