Silicon photonic (SiPh) interposers offer a promising solution to overcome the bandwidth, latency, and energy limitations of electrical interconnects in chiplet-based systems. By enabling dense Wavelength Division Multiplexing (WDM) and high-speed optical signaling, they support scalable and efficient inter-chiplet communication. However, conventional SiPh interposer architectures face critical challenges, including fabricationinduced yield loss due to active photonic integration, and performance degradation from vertical link misalignments during packaging. This paper introduces MARVEL, a scalable and resilient SiPh interposer network that addresses these challenges through architectural and algorithmic innovations. MARVEL employs a passive interposer design, avoiding yield-limiting active components, and proposes to use optical vertical links (OVLs) to provide direct optical connections between chiplets and a centralized optical circuit switch (OCS). To mitigate the effects of packaging-induced misalignment, MARVEL incorporates redundancy-aware OVL selection using lightweight, reconfigurable on-chip switches. A dynamic in situ characterization protocol ranks available OVLs by loss, enabling the system to route traffic through the best performing links. This mechanism ensures 100% system reachability under modeled manufacturing variations. Additionally, MARVEL introduces a loss-aware recursive backtracking routing algorithm with pre-computed lookup tables (LUTs) to optimize switch configurations for reduced insertion loss and tuning power. Comprehensive evaluations—including analytical modeling, Monte Carlo-based variability analysis, and discrete-event network simulation—show that MARVEL achieves up to 82% latency reduction over bus-based architectures and up to 86% improvement compared to prior work under synthetic traffic. On PARSEC benchmark workloads, MARVEL reduces latency by up to 75% while delivering approximately 10% total power savings. These results demonstrate MARVEL’s potential as a robust, energy-efficient, and scalable interposer architecture for next-generation heterogeneous computing platforms, including AI accelerators, high-performance computing (HPC), and data center systems.
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Mahdian et al. (2025) studied this question.
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