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1.3 μm Strain-Compensated InGaAsP Planar Buried Heterostructure Laser Diodes with a TO-Can Package for Optical Fiber Communications, Tsai, Chia-Lung, Chou, Yi-Lun, Wang, Y. S., Chang, S. J., Wu, Meng-Chyi, Lin, W.
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Tsai et al. (2009) studied this question.
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