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The hybrid substrate (organic interposer + build-up package substrate + solder joints + underfill) of multiple systems and heterogeneous integration is investigated. The organic interposer of the hybrid substrate is fabricated by a fan-out chip-last on a temporary panel with two different kinds of dielectric materials, namely, the photo-imageable dielectric and the Ajinomoto Build-Up Film. These two hybrid substrates are supporting two different chips. The flatness of metal lines of the redistribution-layers, the quality of the hybrid substrate after chip-to-hybrid substrate bonding, and the reliability of the solder joints between these two hybrid substrates will be discussed.
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Lau et al. (2023) studied this question.
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