Answers are grounded in this paper and cite their sources.
In this study, the heterogeneous integration of two chips on a 2.3D hybrid substrate using solder joint and underfill is investigated. Emphasis is placed on the materials, design, process, fabrication, and reliability of the package. Drop test and results of the package are also provided.
No takes yet. Share an insight, caveat, or question.
Chou et al. (2022) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: