Answers are grounded in this paper and cite their sources.
Low temperature deposition of low loss silicon nitride (SiN) thin-films is very attractive as it opens opportunities for realization of multi-layer photonic chips and hybrid integration of optical waveguides with temperature sensitive platforms such as processed CMOS silicon electronics or lithium niobate on insulator. So far, the most common low-temperature deposition technique for SiN is plasma enhanced chemical vapor deposition (PECVD), however such SiN thin-films can suffer from significant losses at C-band wavelengths due to unwanted hydrogen bonds. In this contribution we present a back end of line (< 400°C), low loss SiN platform based on reactive sputtering for telecommunication applications. Waveguide losses of 0.8 dB/cm at 1550 nm and as low as 0.6 dB/cm at 1580 nm have been achieved for moderate confined waveguides which appear to be limited by patterning rather than material. These findings show that reactive sputtered SiN thin-films can have lower optical losses compared to PECVD SiN thin-films, and thus show promise for future hybrid integration platforms for applications such as high Q resonators, optical filters and delay lines for optical signal processing.
No takes yet. Share an insight, caveat, or question.
Frigg et al. (2019) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: