Electroless Plating of Silicon Nitride Using (3-Aminopropyl) Triethoxysilane

In this work we demonstrate electroless Cu and Ni–P (using both alkaline and acidic solutions) metallization of a silicon nitride surface. This was done by surface pretreatment with functionalization via silanization, followed by adsorption of nanoparticles onto the surface. Using this method, films of Ni–P and Cu were created and characterized. As a possible application we demonstrate metallization of atomic force microscope probes by Ni–P and Au (on top of the Ni–P from the acidic solution).