Focused-ion-beam ‘‘cutter’’ and ‘‘attacher’’ for micromachining and device transplantation

In focused-ion-beam (FIB) applications of micromachining and device transplantation, four kinds of FIB processes, namely FIB sputtering, FIB-induced etching, redeposition, and FIB-induced deposition, are well utilized. The first and second processes play the role of ‘‘cutter’’ and the third and last processes play the role of ‘‘attacher’’. In this paper, the characteristics of FIB ‘‘cutter’’ and ‘‘attacher’’ are discussed using previously obtained feasibility experimental data and simple simulations.