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Device transplantation using a focused ion beam (FIB) has been proposed as a new high-resolution technique for microdevice assembly as well as device repair. FIB sputtering, redeposition, and FIB-induced deposition each work as a cutter or a fixer. Feasibility experiments have been carried out both for dummy-device transplantation on a silicon substrate and for microgear fabrication.
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Ohnishi et al. (1990) studied this question.
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