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Heat transfer rates across various types of soft solder joints are investigated between 0.06 and 0.5°K using a 3He−4He dilution refrigerator. For Cd-Bi junctions and thin (10 μ) Sn-Pb junctions, the heat flux per unit area and unit temperature difference is 4.7×106 T2.74 erg/sec. This rate is about twice that predicted by the theory of Little. Junctions of Sn-Pb and Sn-In about 40 μ thick have a much lower conductance. The thermal conductivity of bulk Sn-Pb solder is found to be 9900 T2.31 erg/sec-cm-°K.
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W. A. Steyert (1967) studied this question.
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