The authors investigated the application of the carbon-implantation/annealing method for the annealing of the main lifetime limiting defect Z1∕2 in thick 4H–SiC epilayers. Examination of different implantation doses and annealing temperatures showed that finding the optimum conditions is crucial for obtaining thick layers with carrier trap concentration below 1011cm−3 in the whole 100μm epilayer. The carrier lifetime increased from less than 200ns to over 1μs at room temperature in the samples annealed with the carbon-implanted layer. The thick 4H–SiC epilayers after the application of the carbon-implantation/annealing were confirmed to be applicable for fabrication of high-voltage bipolar devices and resulted in improved conductivity modulation. Possible annealing mechanisms are discussed in detail making a comparison between annealing of as-grown material and irradiated material.
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Storasta et al. (2008) studied this question.
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