Investigation of In0.53Ga0.47As for high-frequency microwave power FET's

Submicrometer In0.53Ga0.47As junction field-effect transistors (JFET's) were fabricated using a chemical etching technique. In spite of the well-known low bulk breakdown fields of InGaAs, the source-drain breakdown voltages of the FET's were close to 20 V under pinchoff conditions, indicating a potentially high power-handling capability. At 11 GHz, a 250-µm-wide FET showed a linear gain of 5.2 dB and 17.2-dB . m (53 mW) output power at 1-dB compression point, with a power-added efficiency of 14 percent. Problems of an unexpectedly low electron mobility in the channel, annealing of implanted Be, and oscillations in the drain current-voltage characteristic are discussed.