Answers are grounded in this paper and cite their sources.
Characterization of Atomic Layer Deposited WN x C y Thin Film as a Diffusion Barrier for Copper Metallization , Kim, Soo-Hyun, Oh, Su Suk, Kim, Hyun-Mi, Kang, Dae-Hwan, Kim, Ki-Bum, Li, Wei-Min, Haukka, Suvi, Tuominen, Marko
No takes yet. Share an insight, caveat, or question.
Kim et al. (2004) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: