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Low temperature diffusion of Cr and Si through thin gold films is studied in N 2 and in ( N 2 + CO ) ambients. The out‐diffusion of both Cr and Si to the gold surface is suppressed in the presence of CO . The results are discussed in terms of a model which considers the roles of both the gold film and the ambients used.
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Chin‐An Chang (1980) studied this question.