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Modelling of diffusion bonding has been carried out to quantify the kinetics of the bonding processes and to predict the time for achieving a sound bond. An alternative geometric assumption for the shape of the interfacial cavities to those considered previously was employed. Three subprocesses of bonding were introduced to simplify the modelling. These involved volume and interfacial diffusion coupled with creep, rigid collapse, and surface diffusion. The effects of grain size and phase ratio on diffusion bonding have also been considered. The predictions are compared with existing experimental data for copper and Ti–6Al–4V alloy and in general show good agreement.MST/588
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Guo et al. (1987) studied this question.
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