State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid Bonding

John H. Lau

doi:10.4071/imaps.1542066

October 1, 2021Journal of Microelectronics and Electronic PackagingOpen Access

State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid Bonding

View Full Paper

Ask AI

Bookmark

Share

Key Points

Investigate current technological advances, architectural trends, and future directions in chiplet design, heterogeneous integration packaging, and hybrid bonding.
Synthesized developments across chiplet classifications, design trade-offs, and implementation strategies in semiconductor manufacturing.
Evaluated interfacial interconnect mechanisms, focusing on lateral interconnect topologies and direct copper-to-copper hybrid bonding processes.
Categorized primary lateral interconnect and vertical hybrid bonding techniques that enable high-density, low-latency inter-chiplet communications.
Demonstrated that heterogeneous integration circumvents conventional monolithic die scaling limits by improving fabrication yields and enabling modular intellectual property integration.

Ask about this paper

Answers are grounded in this paper and cite their sources.

Implication

Technical review examines advances in chiplet design and hybrid bonding in advanced semiconductor packaging, highlighting key architectures for next-generation microelectronics.

Abstract

In this study, the recent advances and trends of chip-let design and heterogeneous integration packaging will be investigated. Emphasis is placed on the definition, kinds, advantages and disadvantages, lateral interconnects, and examples of chiplet design and heterogeneous integration packaging. Also, emphasis is placed on the fundamental and examples of hybrid bonding.

Discussion

No takes yet. Share an insight, caveat, or question.

Cite This Study

John H. Lau (2021) studied this question.

synapsesocial.com/papers/6a8408d1309bd08d9172f741 https://doi.org/10.4071/imaps.1542066

View Full Paper

Ask AI

Bookmark

Share

State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid Bonding

Key Points

Ask about this paper

Implication

Abstract

Discussion

Cite This Study

State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid Bonding

Key Points

Ask about this paper

Implication

Abstract

Discussion

Cite This Study

Keep reading

Keep reading