Thermal strain in surface-mount chip resistor assemblies is studied by the finite element method using two- and three-dimensional models. Emphasis is placed on the effects of interconnection geometry on solder joint fatigue. Nine different solder joint geometries are considered.
No takes yet. Share an insight, caveat, or question.
Lau et al. (1987) studied this question.
Synapse has enriched one closely related paper. Consider it for comparative context: