⌘+K

Pulse Explore Communities Researchers Journals

Home Communities Explore

January 1, 1997The Journal of Japan Institute for Interconnecting and Packaging Electronic CircuitsOpen Access

Recent Trend of Reliability Technology. Evaluation of Strength Reliability of Plastic Packaging.

Tōru IKEDA Noriyuki MIYAZAKI

View Full Paper

Ask AI

Bookmark

Share

No abstract yet

We only have this paper's title and publication details.

Read it at the source→

Abstract

,'96

Discussion

No takes yet. Share an insight, caveat, or question.

Cite This Study

IKEDA et al. (1997) studied this question.

synapsesocial.com/papers/6a84635b121b098de683ec37 https://doi.org/10.5104/jiep1995.12.391

View Full Paper

Ask AI

Bookmark

Share

Keep reading

Synapse has enriched 5 related papers. Consider them for comparative context:

1Laser Enhanced Electroless Gold Plating.The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits · Wed,
2Properties of Sn-Bi Solders and Its Interface with Cu.The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits · Wed,
3Dielectric Property Study of Copper Ionic Migration at Insulation Layer on Metal Base PWB.The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits · Wed,
4Environmentally Conscious Engineering in Electronics. 1. A Bonding Method Which is Designed for Separating at the Interface: Reversible Interconnection.The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits · Mon,
5Frequency Doubling in Corona-Poled Glass Film Waveguides.The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits · Mon,

More from The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Plastic Optical Fiber Amplifier and Its Application.Mon,
Complex Effects of Additives of Cl- and Glue on Surface Morphology of Copper Foil for Printed Wiring Boards Electrodeposited at High Speed.Mon,
Environmentally Conscious Engineering in Electronics. 1. Properties of Sn-Ag Binary Alloy as Lead Free Solder and Interface Microstructure with Cu.Mon,
The Evaluation of Thermosetting Polyphenylene Ether for High Frequency Multilayer Printed Circuit Boards.Sun,
Deposition Process of Electroless Copper Plating Using Glyoxylic Acid as a Reducing Agent.Sun,