Residual surface stresses generated in ceramic materials by diamond grinding were studied. The stresses are characterized both by X‐ray measurements of stress magnitudes and by line forces (product of stress and layer thickness) obtained from the bending of plates that were machined on one side. The line forces tend to increase with the hardness of the material but are insensitive to the rate of material removal during grinding (over a limited range of variation). Residual stress measurements are compared with measurements of strengths of the ground surfaces.
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JOHNSON‐WALLS et al. (1986) studied this question.
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