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March 26, 2010IEEE Transactions on Power Electronics

A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module

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PNPuqi NingChinese Academy of SciencesTLThomas G. LeiFord Motor Company (United States)FWFred WangBrigham and Women's Hospital

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Ning et al. (2010) studied this question.

synapsesocial.com/papers/6a84f7c0e7eca461fe847664https://doi.org/10.1109/tpel.2010.2046498
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