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We investigated the possibility of controlling thin film buckling patterns by varying the substrate curvature and the stress induced therein upon cooling. The numerical and experimental studies are based on a spherical Ag core/SiO(2) shell system. For Ag substrates with a relatively larger curvature, the dentlike triangular buckling pattern comes out when the film nominal stress exceeds a critical value. With increasing film stress and/or substrate radius, the labyrinthlike buckling pattern takes over. Both the buckling wavelength and the critical stress increase with the substrate radius.
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Cao et al. (2008) studied this question.
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