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April 1, 1969IEEE Transactions on Electron Devices

Thermal effects on the integrity of aluminum to silicon contacts in silicon integrated circuits

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Authors

RAR. J. AnsteadSFS. R. FloydGoddard Space Flight Center

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Anstead et al. (1969) studied this question.

synapsesocial.com/papers/6a85455a76469a949f43d8d4https://doi.org/10.1109/t-ed.1969.16761
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