This is the authors' abstract. We don't add key points for this paper.
Recently, malfunctions by crosstalk between signal lines have become a problem in an electronic circuit which has been more densely organized and handles signals at higher frequencies. To prevent malfunctions due to these noises, it is important to find the relationship of the crosstalk with the materials and structures of the circuit board. Especially, as the density is increased, the use of multilayered configuration is increased so that the understanding of the crosstalk between interconnects arranged in a three‐dimensional fashion is increasingly more important. Usually, the analysis of crosstalk has been carried out by means of the equivalent circuit analysis. It is not easy to adjust the number of discretizations and the analysis between the three‐dimensional (3‐D) interconnects. In reference to the foregoing, this paper describes a crosstalk analysis between parallel microstrips by means of the finite‐difference time‐domain (FD‐TD) method which, among the 3‐D electromagnetic field analysis methods, requires small memory and computational time. Good agreement is confirmed between the thoretical and experimental results on the crosstalk waveforms and the crosstalk coefficient. Hence, the effectiveness of the FD‐TD method for the crosstalk analysis has been confirmed. It is believed that the FD‐TD method is extremely effective for analysis in the circuit design.
Answers are grounded in this paper and cite their sources.
No takes yet. Share an insight, caveat, or question.
Maeda et al. (1991) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: