This paper deals with the problem of evaluating the electromagnetic coupling between the traces of printed circuit boards. Specifically, the paper insights into models and methods applicable to extract the parasitic mutual capacitance, assuming the typical operating conditions of hard-switching switch-mode power supplies. The case study analyzed herein refers to the unwanted coupling between traces related to power and control sub-circuits. Several approaches are compared, and implemented in commercial simulation tools, spanning a variety of models, from static 2D ones to full-wave 3D ones. Some simple criteria are assessed to guide the correct use of such tools, depending on the physical and geometrical parameters of the problem.
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Chiariello et al. (2024) studied this question.
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