Influence of Conductor Arrangement on Different Layers of the Printed Circuit Board Under its Exposure to Electrostatic Discharge

The paper analyzes self- and mutual capacitances of fragments of two-layer printed circuit boards (PCBs) based on microstrip (MTL), coupled (CTL), and coplanar (CopTL) transmission lines (TLs) when the distance between conductors is changed. It is shown that increasing the substrate thickness by a factor of 10 leads to a 2-fold decrease in the self-capacitance with perpendicular and 7.4-fold decrease with parallel conductor arrangements in the MTL-based models. Increasing the substrate in CTL-based models leads to a decrease in self and an increase in mutual capacitance. For CopTL, increasing the substrate thickness leads to a decrease in the self and mutual capacitance with perpendicular arrangement of conductors. Parallel conductor arrangement leads to an increase in the self and mutual capacitance. We have also analyzed the influence of conductor arrangement when the PCB is exposed to electrostatic discharge (ESD). For the MTL-based models, perpendicular arrangement of conductors leads to a decrease in the crosstalk at the near end by 8 times, and at the far end - by 5.5 times. The perpendicular arrangement of the CopTL conductors reduced the near-end crosstalk by a factor of 35 and the far-end by a factor of 8. Analysis of the CTL-based PCB showed that the perpendicular arrangement of conductors leads to an increase in the crosstalk on a passive conductor located on the same layer as the active one by 1.5 times. However, the crosstalk on conductors located on the opposite layer decreased by 9.3 times at the near end, and by 6.6 times at the far end. Thus, when designing radio electronic equipment., it is necessary to take into account these features of the location of conductors to increase its resistance to electromagnetic interference. The developed models can be used in a comprehensive analysis of electronic components of radio electronic equipment under the destabilizing ESD impact.