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A novel masterslice MMIC is presented that expands the possibilities for three-dimensional (or multilayer) MMIC technology. This MMIC incorporates two levels of ground metals, resulting in an effective selection of master-array elements on the wafer surface by using the lower-level metal and a circuit-stacking effect by the upper one. X-band amplifier and receiver MMIC's on 3/spl times/1 and 6/spl times/3 array-units, respectively, are also demonstrated in very small areas.>
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Tokumitsu et al. (1995) studied this question.
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