Advanced material and processing technologies of polyimide applied to various substrates were investigated and studied for high density electronic devices. Precisely controlled temperature profiles in each processing step can realize required chemical structures of polyimide materials and the excellent polyimide films. Thick film patterning of photosensitive polyimide is extremely difficult because the exposed top layer is dissolved before the unexposed area is developed as the result of UV absorption and reaction at the bottom being less than that at the top layer. For removing the thin film residue on copper and/or copper containing alloys, a simple patterning process using a solution containing hydrazine has been developed. Newly developed techniques such as screen printing, shower developing, and microwave‐assisted curing enable the realization of more precise patterning of photosensitive polyimide. As an excellent pattern of polyimide films was obtained, functional electronic devices such as hybrid IC's and contact type linear image sensors could be developed by applying these advanced technologies.
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Endo et al. (1987) studied this question.