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The planarization properties or thickness changes on topographical features are examined in detail for several types of spun‐on polymer films. A profilometer is used to measure the step height changes of isolated line features of various dimensions. The viscosity of the solution appears to give a reasonable indication of the spun‐on planarization properties. However, in many cases, the thermal flow of the polymer during a subsequent curing procedure is the dominant planarization mechanism. Methods for producing highly planarized surfaces with positive resist materials are described along with the effects of feature size on the planarization properties.
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L. K. White (1983) studied this question.
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